New PDF release: Arbitrary Modeling of TSVs for 3D Integrated Circuits

By Khaled Salah,Yehea Ismail,Alaa El-Rouby

ISBN-10: 3319076108

ISBN-13: 9783319076102

ISBN-10: 3319374974

ISBN-13: 9783319374970

This booklet provides a wide-band and know-how self reliant, SPICE-compatible RLC version for through-silicon vias (TSVs) in 3D built-in circuits. This version debts for a number of results, together with pores and skin impact, depletion capacitance and within sight touch results. Readers will make the most of in-depth insurance of options and know-how reminiscent of 3D integration, Macro modeling, dimensional research and compact modeling, in addition to closed shape equations for the via silicon through parasitics. ideas lined are tested by utilizing TSVs in purposes resembling a spiral inductor and inductive-based verbal exchange method and bandpass filtering.

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Arbitrary Modeling of TSVs for 3D Integrated Circuits (Analog Circuits and Signal Processing) by Khaled Salah,Yehea Ismail,Alaa El-Rouby


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